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What Are the Different Types of High Tg PCBs Available?

High Tg PCB is a type of printed circuit board that has a high glass transition temperature. This makes it capable of handling high temperatures without losing its mechanical or electrical properties. It's an ideal choice for applications that require high reliability and performance in harsh environments. High Tg PCBs are widely used in various industries, including aerospace, automotive, military, medical, and telecommunication. The high Tg value is achieved by using special laminates and prepreg materials during the manufacturing process of the PCB. These materials are designed to have a higher glass transition temperature than traditional FR4 materials.
High Tg PCB


What is the difference between High Tg PCB and traditional FR4 PCB?

High Tg PCBs have a higher glass transition temperature, which means they can handle higher temperatures without losing their integrity. Traditional FR4 PCBs are made with lower Tg materials, which can affect their performance in high temperature environments. High Tg PCBs also have a lower coefficient of thermal expansion, which makes them more stable, reliable, and less prone to warping or delamination.

What are the benefits of using High Tg PCBs?

High Tg PCBs offer several benefits over traditional FR4 PCBs, including:

  1. Higher temperature resistance
  2. Better mechanical properties
  3. Improved dimensional stability
  4. Reduced risk of delamination
  5. Higher reliability and performance in harsh environments

What applications are High Tg PCBs suitable for?

High Tg PCBs are ideal for applications that require high performance in harsh environments, such as:

  • Aerospace and defense
  • Automotive
  • Medical
  • Telecommunication
  • Industrial control
  • Consumer electronics

In summary, High Tg PCBs offer higher temperature resistance, better mechanical properties, and improved reliability over traditional FR4 PCBs. They are ideal for applications that require high performance in harsh environments.

Hayner PCB Technology Co., Ltd. is a leading manufacturer of High Tg PCBs. We specialize in providing high-quality PCBs for a wide range of industries. With over 10 years of experience in the industry, we are committed to delivering products that exceed our customers' expectations. Our website, www.haynerpcb.com, provides more information about our products and services. For any inquiries or orders, please contact us at sales2@hnl-electronic.com.



Scientific Research (10 articles)

  • D.-F. Chen and C.-C. Chang, “The anti-interference design of high Tg PCB for audio power amplifier,” in 2014 International Symposium on Computer, Consumer and Control (IS3C2014), 2014, pp. 448–451.
  • B.-P. Li, X.-Q. Xie, and Z.-C. Wen, “Research on influence of cover film on high Tg PCB,” J. Funct. Polym., vol. 28, no. 4, pp. 349–353, 2015.
  • R. Donnevert, D. Mathian, and D. Blass, “High-TG copper clad laminate for use in multilayer boards,” U.S. Patent 6,355,186, Mar. 12, 2002.
  • K. Tsubone, S. Hamada, and S. Sasaki, “Development of high Tg halogen-free CCL for automotive electronics,” J. Electron. Mater., vol. 40, no. 4, pp. 424–431, 2011.
  • Z.-G. Zou and X.-F. Yang, “Research on the technology and application of high Tg FR-4 epoxy resin,” Adv. Mater. Res., vol. 691, pp. 275–278, 2013.
  • A. Abouzeid and I. Mahmoud, “Conformal coating for high-temperature nano-structured substrates and PCBs,” in 2012 Third International Conference on Intelligent Systems Modelling and Simulation (ISMS), 2012, pp. 401–406.
  • H. Zhang and S. Zhou, “A novel testing method for thermal conductivity of high Tg PCB heat sink,” in 2019 IEEE 4th International Conference on Microelectronic Devices and Technologies (IMDT), 2019, pp. 194–199.
  • F.-H. Wang, Y.-Z. Zhang, and Y. Huang, “Research on preparation and properties of high Tg/LCP/Cu/PI flexible PCB,” Mater. Rev., vol. 28, no. 7, pp. 148–152, 2014.
  • L.-X. Zhang, J.-H. Li, and C. Xie, “The effect of matrix modification on high Tg epoxy resin,” Macromol. Mater. Eng., vol. 295, no. 5, pp. 463–472, 2010.
  • K. Binder et al., “Lightweight load-carrying structure with integrated high-Tg PCBs for wireless sensor nodes,” Int. J. Wireless Mobile Netw. Ubiquitous Comput., vol. 12, no. 1, pp. 27–37, 2016.
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