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What are the PBC assembly processes?

There are three main types of PBC assembly processes.

1.Through hole technology assembly process:

This technology refers to the way components are connected to a PCB and soldered into place

Through-hole technology involves placing components on top of a circuit board and then soldering them into place. Solder creates a mechanical bond between the two materials, resulting in a safe and stable connection. Therefore, through-hole technology is often used in applications where reliability is critical.

The most common through hole component types are resistors (fixed and variable), transistors (NPN and PNP), diodes, capacitors, ICs (integrated circuits), LEDs (light emitting diodes), inductors (coils), transformers, and fuses and relays (switches). Some boards also support through-hole devices called jumpers, which allow you to change certain settings, such as voltage levels or other parameters.

2.Surface mount technology assembly process:

This assembly process is a popular choice among electronics manufacturers because it saves material and labor costs.

The process involves placing components onto a circuit board, as opposed to through-hole mounting, which involves inserting leads into holes in the circuit board.

These holes are usually smaller than the leads, making this type of installation cheaper and easier than through-hole installation.

This type of assembly can be done manually or using automated machines. Manual assembly requires more skill from the assembler but automated systems allow for higher productivity.

3.Mixed technology assembly process:

This is a process involving the use of SMT and through-hole technology. The main advantage of this method is that it allows you to assemble very small components, such as I and resistors, using SMT technology, while holding larger components such as connectors and transformers in place via through-hole components.

The mixed-technology assembly process gives you more flexibility in the types of boards you can create, but it also has some drawbacks. The first disadvantage is that because you are combining different PCB types, the design needs to be flexible enough to accommodate them all. This means that if you use a mixed-technology assembly process, it's harder to ensure that your product works as expected.

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