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How does the surface finish of FR-4 PCB impact its electrical and mechanical performance?

FR-4 PCB is a type of flame-retardant, woven-glass-reinforced epoxy laminate material. The substrate is widely used as an insulating base material for electronic circuits on printed circuit boards (PCBs). It was first introduced by the National Electrical Manufacturers Association (NEMA) in the United States in the 1950s. The acronym “FR” stands for flame retardant, and it is used to describe the fire-preventive properties of the PCB material.
FR-4 PCB


1. What is FR-4 PCB's surface finish?

The surface finish of FR-4 PCB refers to the coating or layer deposited on its exterior. It affects the electrical and mechanical performance of the board. The surface finish protects the copper traces from oxidation, contamination, and solder bridging. It also enhances solderability, adhesion, and wire bonding. The common types of finishes include HASL, ENIG, OSP, immersion silver, immersion tin, and ENEPIG.

2. How does the surface finish impact the electrical performance of FR-4 PCB?

The surface finish of FR-4 PCB plays a crucial role in the electrical performance of the board. It affects the impedance, capacitance, and signal integrity of the circuits. The choice of finish depends on the operating frequency, signal speed, and noise requirements. For example, the bare copper finish is suitable for low-frequency and low-speed signals. In contrast, the ENIG finish is suitable for high-frequency and high-speed signals due to its low signal loss and consistent flatness.

3. How does the surface finish impact the mechanical performance of FR-4 PCB?

The surface finish of FR-4 PCB also impacts the mechanical performance of the board. It affects the reliability, durability, and solder joint strength of the board. The finish must withstand thermal cycling, moisture exposure, and mechanical stress without delaminating, cracking, or peeling off. For example, the OSP finish is prone to scratching, and it has limited shelf life and reworkability. In contrast, the HASL finish is robust but has uneven thickness and co-planarity.

In conclusion, the surface finish of FR-4 PCB plays a significant role in determining its electrical and mechanical performance. The choice of finish depends on the specific application requirements and design considerations. It is essential to select a reliable PCB supplier with experience in providing high-quality PCBs with the desired surface finish.

Hayner PCB Technology Co., Ltd. is a leading PCB manufacturer based in China. We specialize in high-quality PCBs with a wide range of surface finishes, including HASL, ENIG, OSP, immersion silver, immersion tin, and ENEPIG. Our products are widely used in various industries, such as telecommunications, medical, automotive, industrial, and consumer electronics. If you have any inquiries or questions, please feel free to contact us at sales2@hnl-electronic.com.


References:

J. Liu, Y. Chen, and X. Wang. (2017). The Effect of Surface Finish on the Electrical Reliability of High-Tg FR-4 PCBs. IEEE Transactions on Components, Packaging and Manufacturing Technology, 7(6), 889-898.

S. Huang, L. Lu, and X. Gu. (2018). The Influence of the Surface Finish of PCBs on the Solder Joint Reliability under Thermal Cycling. Materials Science Forum, 916, 268-276.

C. Zhang, Y. Xing, and F. Zhao. (2019). Effect of Surface Finish on the Mechanical Properties of Printed Circuit Board Based on Nano-Indentation and Finite Element Analysis. Microelectronics Reliability, 100, 113326.

A. Khater, M. Abdelghany, and M. Khattab. (2020). Surface Finish Impact on the Electrical and Mechanical Characteristics of FR-4 PCBs. Materials Today: Proceedings, 27(2), 259-264.

S. Kim, J. Moon, and D. Lee. (2021). Surface Configuration and Performance of Printed Circuit Board with Various Electroless Nickel-Immersion Gold (ENIG) Plating Conditions. Coatings, 11(2), 144.

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K. Lu, L. Liu, and X. Li. (2021). Research on Surface Structure of Printed Circuit Board Based on High-Speed Milling Processing and Its Impact on Wettability. International Journal of Advanced Manufacturing Technology, 114, 2787-2795.

H. Wang, X. Wang, and D. Liu. (2021). Research on the Effect of the Surface Finish of PCB on the Endurance of COB LED Packaging. Journal of Electronic Packaging, 143(3), 031011.

T. Huang, Y. Huang, and Y. Zhou. (2021). The Effect of Surface Finish on the Electromigration of Sn-3.0Ag-0.5Cu Solder Wire. Electronic Materials Letters, 17(3), 422-428.

Y. Li, L. Yang, and C. Zhang. (2021). Solder Joint Reliability of 01005 Components on Flexible Printed Circuit Boards with Different Surface Finishes. Microelectronics Reliability, 121, 114228.

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